Detection Solution:
This solution enables the accurate measurement of height differences and thickness dimensions for a wide range of components. This equipment leverages optical imaging and laser technology to perform non-contact measurements. The dual-laser structure enables precise measurement of the Z-axis height, flatness, and thickness of both sides of components.
Key features include:
· Robust Construction: A granite base, high-precision linear guides, a lightweight aluminum alloy frame, and a glass workbench ensure stability and accuracy.
· Advanced Optics: Computer-controlled lighting sources and dual laser sensors provide optimal illumination and precise data capture.
· Precise Motion Control: Precision ball screw transmission ensures smooth and accurate movement.
Measurement application:
It is mainly used in the flatness, height, thickness and radian detection of graphene, graphene wafer carrier, FBC soft board, etc.
total 0 Sheet,Only 5 images can be uploaded, each less than 5m.